pk 17 3 (v1. 5 ) a pril 2 6 , 201 3 www.xilinx.com 1 pk 17 3 (v 1 . 5 ) april 2 6 , 201 3 100% material declaration data sheet for vq 100 package average weight: 0. 5392 g component substance description cas number or description percentage of component use in product component weight/ substance weight (grams) component percent of total silicon die 0.0 17360 3.220 s ilicon (si) 7440 - 21 - 3 100.00 0.0 17360 die attach 0.0 25760 4.778 silver (ag) 7440 - 22 - 4 72.00 0.0 18547 epoxy resin trade secret 1 5.00 0.00 3 864 anhydride trade secret 1 0.00 0.00 2 576 1,4 - butanedioldiglycid yl ether 2425 - 79 - 8 3.00 0.000 773 mold compound 0. 347130 64.385 epoxy r esin trade secret 7.00 0. 0 24299 phenol r e sin trade secret 5.00 0.0 17357 carbon black 1333 - 86 - 4 0.30 0.00 1041 fused s ilica 60676 - 86 - 0 8 7. 7 0 0. 304433 leadframe 0. 140910 2 6.136 copper (cu) 7440 - 50 - 8 9 8.28 0. 138486 chromium (cr) 7440 - 47 - 3 0.25 0.000 352 tin (sn) 7440 - 31 - 5 0.25 0.000 352 zinc (zn) 7440 - 66 - 6 0.22 0.000 310 silver (ag) 7440 - 22 - 4 1.00 0.00 1409 solder plating 0. 00 5910 1. 096 tin (sn) 7440 - 31 - 5 85.00 0.00 5024 lead (pb) 7439 - 92 - 1 15.00 0.000 887 gold wire 0.0 0 2081 0. 386 gold (au) 7440 - 57 - 5 99.00 0.00 2060 palladium 7440 - 05 - 3 1.00 0.0000 21 ? copyright 2006 - 2013 xilinx, inc . xilinx, the xilinx logo, virtex, spartan, ise, and other designated brands included herein are trademarks of xilinx in the united states and other countries. all other trademarks are the property of their respective owners
100% material declaration data sheet for vq 100 package pk173 (v1.5 ) april 2 6 , 2013 www.xilinx.com 2 revision history the following table shows the revision history for this document. notice of disclaimer xilinx regards this materials data to be correct but makes no guarantee as to its accuracy or completeness, including, but not limited to, with respect to its compliance with applicable environmental laws and regulations. xilinx subcontracts the production, test and assembly of hardware devices to independent third - party vendors and materials suppliers (contractors). all data pr ovided hereunder is based on information received from contractors. xilinx has not independently verified the accuracy or completeness of this information which is provided solely for your reference in connection with the use of xilinx products . date version description of revisions 0 3/2 0/ 06 1.0 initial xilinx release. 07/05/06 1.1 100% material declaration 10/05/06 1.2 corrected component descriptions 11/18/11 1.3 updated component weights and descriptions 08/24/12 1.4 updated cas # in die attach 04/ 2 6 /13 1.5 updated cas description in die attach
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